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Maximus Ii Gene Motherboard Liste Qualifizierter Händler Für Ddr2-667Mhz - Asus Maximus II Gene Handbuch

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Maximus II GENE Motherboard
Liste qualifizierter Händler für DDR2-667MHz
Anbieter
Teilnr.
Apacer
78.91G92.9K5
Apacer
78.01G9O.9K5
Apacer
78.A1G9O.9K4
CORSAIR
VS 512MB667D2
CORSAIR
VS1GB667D2
ELPIDA
EBE51UD8AEFA-6E-E
G.SKILL
F2-5400PHU2-2GBNT
G.SKILL
F2-5300CL5D-4GBMQ
GEIL
GX21GB5300SX
GEIL
GX22GB5300LX
GEIL
GX24GB5300LDC
Hynix
HYMP112U64CP8-Y5
Hynix
HYMP 512U64CP8-Y5
KINGSTON
KVR667D2N5/ 512
KINGSTON
KVR667D2N5/2G
KINGSTON
KVR667/D2N5/1G
KINGSTON
KVR667D2E5/1G
KINGSTON
KVR667D2E5/2G
KINGSTON
KVR667D2N5/2G
NANYA
NT 512T64U88B0BY-3C
NANYA
NT2GT64U8HB0JY-3C
OCZ
OCZ26671024V
SAMSUNG
M378T6553EZS-CE6
SAMSUNG
M378T2953EZ3-CE6
SAMSUNG
M378T5263AZ3-CE6
Super Talent T6UA 512C5
Super Talent T6UB1GC5
TwinMOS
8D-23JK5M2ETP
Asint
SLX264M8-J6E
Asint
SLY2128M8-J6E
CENTURY
26V2H8
CENTURY
26VOH8
Dynet
DNHM5U 512C8FE-A6
Kingbox
N/A
Kingbox
N/A
2-22
Chip-
SS/
Größe
Hersteller
DS
512MB
SS
APACER
1024MB
SS
APACER
2048MB
DS
APACER
512MB
SS
N/A
1024MB
DS
N/A
512MB
SS
ELPIDA
2048MB(Kit of 2) DS
G.Skill
4096MB(Kit of 2) DS
N/A
1024MB
DS
N/A
2048MB
DS
N/A
4096MB(Kit of 2) DS
N/A
1024MB
SS
HYNIX
1024MB
DS
HYNIX
512MB
SS
KINGSTON D6408TR7CGL25U
2048MB
SS
SAMSUNG K4T1G084QE
1024MB
DS
ELPIDA
1024MB
DS
ELPIDA
2048MB
DS
MICRON
2048MB
DS
KINGSTON D1288TPFCGL25U
512MB
SS
NANYA
2048MB
DS
1024MB
SS
Ramos
512MB
SS
SAMSUNG K4T51083QE
1024MB
DS
SAMSUNG K4T51083QE
4096MB
DS
SAMSUNG K4T2G084QA-HCE6
512MB
SS
N/A
1024MB
DS
N/A
512MB
SS
TwinMOS
512MB
SS
Asint
1024MB
SS
Asint
512MB
SS
HYNIX
1024MB
DS
HYNIX
512MB
SS
Dynet
1024MB
SS
KINGBOX
1024MB
DS
KINGBOX
Timing Dimm
Chip-Nr.
(BIOS)
AM4B5708JQJS7E
5
AM4B5808CQJS7E
5
AM4B5808CQJS7E
5
64M8CFEG
N/A
64M8CFEG
N/A
E5108AE-6E-E
5
D264M8GCF
5-5-5-15
Heat-Sink Package
5-5-5-15
Heat-Sink Package
Heat-Sink Package
5-5-5-15
Heat-Sink Package
5-5-5-15
HY5PS1G831CFP-Y5
5
HY5PS12821CFP-Y5
5
667-5-5-5-15 1.8
667-5-5-5-15 1.8
E5108AJBG-6E-E
667-5-5-5-15 1.8
E5108AGBG-6E-E(ECC)
D9HNL(ECC)
667-5-5-5-15 1.8
NT5TU64M8BE-3C
5
NT5TU128M8BJ-3C
5
RC1GT084CA0-53EC
5
5
5
5
Heat-Sink Package
5
Heat-Sink Package
5
TMM6208G8M30C
5
DDRII6408-6E
DDRII1208-6E
HY5PS12821CFP-Y5
5
HY5PS12821CFP-Y5
5
DN5HS82CFE-A6
EPD2128082200E-4
EPD264082200E-4
Kapitel 2: Hardware-Beschreibungen
DIMM-
Sockelunterstützung
(optional)
Spannung
A*
B*
C*
N/A
N/A
1.7-1.9
1.8
1.8-1.9
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.85
1.85
1.8

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