Asus P7P55D-E PRO Benutzerhandbuch Seite 35

P7P55D-E PRO Motherboard Liste Qualifizierter Anbieter (QVL) DDR3-
1866MHz für CPU mit 2.66GHz
Anbieter Artikelnummer
Apacer 78.0AGCQ.CBZ(XMP)
Crucial BL12864BE2009.8SFB3(EPP) 1GB
G.SKILL F3-16000CL7T-6GBPS(XMP) 6GB(Kit of 3) DS
G.SKILL F3-16000CL9T-6GBPS(XMP) 6GB(Kit of 3) DS
KINGSTON KHX16000D3K2/2GN(EPP)
KINGSTON KHX16000D3K3/3GX(XMP)
KINGSTON KHX16000D3ULT1K3/
6GX(XMP)
KINGSTON KHX16000D3T1K3/6GX(XMP) 6GB(Kit of 3) DS
OCZ OCZ3FXT20002GK
OCZ OCZ3P20002GK(EPP)
OCZ OCZ3P2000EB2GK
Gingle 9CAASS37AZZ01D1
P7P55D-E PRO Motherboard Liste Qualifizierter Anbieter (QVL) DDR3-
1866MHz für CPU mit 2.8 und 2.93GHz
Anbieter Artikelnummer
CORSAIR TR3X3G1866C9D(XMP)
CORSAIR TR3X6G1866C9D
KINGSTON KHX14900D3K3/3GX(XMP) 3GB
OCZ OCZ3RPR1866C9LV3GK
OCZ OCZ3RPR1866C9LV6GK
Super Talent W1866UX2GB(XMP)
Patriot PVS32G1866LLK(XMP)
Patriot PVS32G1866LLK(XMP)
P7P55D-E PRO Motherboard Liste Qualifizierter Anbieter (QVL) DDR3-
2000MHz für CPU mit 2.66GHz
Anbieter Artikelnummer
Apacer 78.0AGCQ.CBZ(XMP)
Crucial BL12864BE2009.8SFB3(EPP)
G.SKILL F3-16000CL7T-6GBPS(XMP)
G.SKILL F3-16000CL9T-6GBPS(XMP)
KINGSTON KHX16000D3K2/2GN(EPP)
KINGSTON KHX16000D3K3/3GX(XMP)
KINGSTON KHX16000D3ULT1K3/6GX(XMP) 6GB(Kit 0f 3) DS N/A
KINGSTON KHX16000D3T1K3/6GX(XMP)
OCZ OCZ3FXT20002GK
OCZ OCZ3P20002GK(EPP)
OCZ OCZ3P2000EB2GK
Gingle 9CAASS37AZZ01D1
ASUS P7P55D-E PRO
SS/ Chip-
Größe Chip-Nr.
DS Marke
3GB(Kit of 3) SS N/A Heat-Sink Package 9-9-9-27(1066-8-8-8-20)
SS N/A Heat-Sink Package 9-9-9-28(1333-9-9-9-24) 2
N/A Heat-Sink Package 7-8-7-20(1066-8-8-8-20) 1.65
N/A Heat-Sink Package 9-9-9-24(1066-8-8-8-20) 1.65
2GB(Kit of 2) SS N/A Heat-Sink Package
3GB(Kit of 3) SS N/A Heat-Sink Package 9(1333-9-9-9-24)
6GB(Kit 0f 3) DS N/A Heat-Sink Package 8(1066-8-8-8-20)
N/A Heat-Sink Package 9(1066-8-8-8-20)
2GB(Kit of 2) SS N/A Heat-Sink Package 8
2GB(Kit of 2) SS N/A Heat-Sink Package 9
2GB(Kit of 2) SS N/A Heat-Sink Package 9-8-8(1066-8-7-7-20)
2BG DS N/A Heat-Sink Package 9-9-9-24
SS/ Chip-
Größe Marke Chip-Nr.
DS
3GB(Kit of 3) SS N/A Heat-Sink Package 9-9-9-24(1866-9-9-9-24) 1.65
6GB(Kit of 3) DS N/A Heat-Sink Package 9-9-9-24(1866-9-9-9-24) 1.65
SS N/A Heat-Sink Package 9(1333-9-9-9-24)
3GB(Kit of 3) SS N/A Heat-Sink Package 9-9-9(1066-7-7-7-20)
6GB(Kit of 3) DS N/A Heat-Sink Package 9-9-9(1066-7-7-7-20)
2GB(Kit of 2) SS N/A Heat-Sink Package 8-8-8-24(1333-9-9-9-24)
2GB(Kit of 2) SS N/A Heat-Sink Package 8-8-8-24(1066-7-7-7-20) 1.9
2GB(Kit of 2) SS N/A Heat-Sink Package 8-8-8-24(1866-8-8-8-24) 1.9
SS/ Chip-
Größe Marke Chip-Nr.
DS
3GB(Kit of 3) SS N/A Heat-Sink Package 9-9-9-27(1066-8-8-8-20)
1GB SS N/A Heat-Sink Package 9-9-9-28(1333-9-9-9-24) 2
6GB(Kit of 3) DS N/A Heat-Sink Package 7-8-7-20(1066-8-8-8-20) 1.65
6GB(Kit of 3) DS N/A Heat-Sink Package 9-9-9-24(1066-8-8-8-20) 1.65
2GB(Kit of 2) SS N/A Heat-Sink Package
3GB(Kit of 3) SS N/A Heat-Sink Package 9(1333-9-9-9-24)
Heat-Sink Package 8(1066-8-8-8-20)
6GB(Kit of 3) DS N/A Heat-Sink Package 9(1066-8-8-8-20)
2GB(Kit of 2) SS N/A Heat-Sink Package 8
2GB(Kit of 2) SS N/A Heat-Sink Package 9
2GB(Kit of 2) SS N/A Heat-Sink Package 9-8-8(1066-8-7-7-20)
2GB DS N/A Heat-Sink Package 9-9-9-24
Takt
Spanng.
Lable(Bios)
2.0
1.65
1.65
1.65
1.9
1.9
1.8
DIMM-Sockel-
Unterstützung
Takt
Spanng.
(Optional).
Lable(Bios)
A*
•
•
1.65 •
1.65 •
1.65 •
•
•
Takt
Spanng.
Lable(Bios)
2.0
1.65
1.65
1.65
1.9
1.9
1.8
DIMM-Sockel-
Unterstützung
(Optional).
A* B* C*
•
• • •
• •
• •
• •
• • •
• • •
• • •
• •
• •
• •
• • •
B* C*
•
• •
•
•
•
• •
•
•
DIMM-Sockel-
Unterstützung
(Optional).
A* B* C*
•
• • •
• •
• •
• •
• • •
• • •
• • •
• •
• •
• •
• • •
2-17